| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_786a55964f0623938e701b4510cacfff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6a916e03e9b9d6e2e9655219cd75abb5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15151
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 |
| filingDate |
2016-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e82f647230703ae4f6095d8c09a898df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bbe5555c7480e9efe25848f0c374b23a |
| publicationDate |
2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10083912-B2 |
| titleOfInvention |
Method of packaging integrated circuit die and device |
| abstract |
A package substrate having an opening and through-substrate interconnect structures is attached to a temporary carrier such as an adhesive film. The active surface of an IC die is placed in contact with the carrier substrate within the opening, to temporarily attach the die to the carrier substrate. Another die is attached to the side of the first die furthest from the carrier substrate. In one embodiment, the dies are attached to each other using an epoxy so that their respective non-active surfaces face each other. Bond wires are connected between interconnects at the active surface of the second die and the substrate. The wires are then encapsulated. After removal of the carrier substrate, a build-up interconnect structure is formed that includes external interconnects of the package substrate, such as solder balls of a ball grid array package. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10510478-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11024569-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019051590-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10825602-B2 |
| priorityDate |
2015-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |