| abstract |
A semiconductor device that achieves high reliability is provided. According to one embodiment, a semiconductor device includes a plurality of first semiconductor chips, an organic resin provided between the first semiconductor chips, and a first semiconductor chip provided above the first semiconductor chip. A first semiconductor unit having a wiring layer electrically connected to each other and a plurality of circuit board connection electrodes provided on the wiring layer; and a circuit board connection on the wiring layer side of the first semiconductor unit A second semiconductor unit fixed to a region sandwiched between the electrodes, having a second semiconductor chip, and electrically connected to the first semiconductor unit. [Selection] Figure 1 |