| abstract |
The utility model relates to a semiconductor device, it includes: again, distribution structure, it includes: first distribution layer again, it includes: first dielectric layer, it includes a dielectric material, and first electrically conductive circuit, and second distribution layer again, it includes: the second dielectric layer, it is including being different from a dielectric material's the 2nd dielectric material, and the electrically conductive circuit of second, its electrically coupled is extremely first electrically conductive circuit, a semiconductor grain, its attach connect to first distribution layer again, the 2nd semiconductor grain, its attach connect to first distribution layer again, and electrically conductive interconnect structure, its attach connect to the second is distribution layer again. As non -limiting's example, the various characteristics of this utility model content provide various semiconductor package structures, and it is the distribution structure again including a slight interval that approaches, its manufacturability that can reduce the cost, promote the fiducial level and / or promote the semiconductor device. |