| abstract |
A semiconductor device comprising: a semiconductor die (101, 103), the semiconductor die (101, 103) having a first side, a second side opposite to the first side, and a sidewall extending between the first side and of the second side; a protective layer (109) over the semiconductor die (101, 103), the protective layer having a side wall; vias (503) through the protective layer (109); an encapsulation material (303) that covers the semiconductor die (101, 103), wherein the encapsulation material (303) is in physical contact with the first side and the side wall of the semiconductor die and a first portion of the side wall of the protective layer, with a second portion of the side wall not in physical contact with the protective layer the encapsulation material (303) stands; and a redistribution layer (401, 501) in electrical communication with at least one of the vias (503), the redistribution layer (401, 501) extending over the encapsulation material (303); wherein the redistribution layer is in physical contact with the encapsulation material (303) . |