| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81bbed339049c84138a09736b647d40e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffab21e7d8446435647bf042f12d0dc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67268daadacdf36eb3256477758a292a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c8503ac5faba2caa128bd106b8700dc |
| publicationDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9406552-B2 |
| titleOfInvention |
Semiconductor device having conductive via and manufacturing process |
| abstract |
In accordance with the present invention, there is provided a semiconductor device comprising a semiconductor die or chip, a package body and a through package body via. The semiconductor chip includes a plurality of conductive pads. The package body encapsulates a sidewall of the semiconductor chip, and has at least one hole formed therein having a sidewall which is of a prescribed first surface roughness value. The through package body via is disposed in the hole of the package body and comprises a dielectric material and at least one conductive interconnection metal. The dielectric material is disposed on the sidewall of the hole and defines at least one bore having a sidewall which is of a second surface roughness value less than the first surface roughness value. The interconnection metal is disposed within the bore. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749576-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10297531-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017301663-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9960121-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11272618-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016315052-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11410977-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10128226-B2 |
| priorityDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |