| abstract |
This document discusses, inter alia, a microelectronic system comprising a mold compound having a base layer and a surface layer on the base layer, and a seed layer deposited on the surface layer of the mold compound. The mold compound comprises a monomeric epoxy resin, a hardener, a filler material, and a polymer interface phase material, wherein the polymer interface phase material forms the surface layer of the mold compound, the surface layer itself having the crystal The adhesion strength of the seed layer is greater than that of the monomer epoxy resin and the hardener. |