| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16503
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81457
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2019-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54176e6a44379f214a8224542edf9b1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36355eec64b18cdb1c1acf1a268c6ec7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f3cde55bbf68ca4be55ea1759af20b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d51401acf74deb0218b9490f0b82dcbf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdb11879ce98a7dbf58e6b3d3712cc0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdcbaff831c5786971dd6f64e23d6b48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99cbfebe457785d3068716c7378050c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cd172148959d5efc35742cc2cc78b80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68844a782eba889957423933a6cd15d7 |
| publicationDate |
2020-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10854541-B2 |
| titleOfInvention |
Electromigration resistant and profile consistent contact arrays |
| abstract |
A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration. |
| priorityDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |