| abstract |
This invention is a method for manufacturing a high-frequency module device. A high-frequency circuit unit ( 2 ) in which first to third unit wiring layers ( 5 ) to ( 7 ), each having a capacitor ( 12 ) or the like at a part, are stacked and formed on flattened one surface of a dummy board ( 30 ) so that a third pattern wiring is exposed from a connection surface ( 2 a ) of an uppermost layer is mounted on a mounting surface ( 3 a ) of a base board ( 3 ) where an input/output terminal part ( 18 ) is exposed, in such a manner that the third pattern wiring and the input/output terminal part are connected with each other, and after that, the dummy board is removed. A high-frequency module device is thus manufactured. |