| abstract |
The invention discloses the method for test, manufacture and encapsulation semiconductor devices.In certain embodiments, testing the method for semiconductor devices includes providing the integrated circuit lead with the contact being disposed thereon, and insulating materials is formed above integrated circuit lead and contact, and opening is formed in insulating materials and above contact.Eutectic material is formed in the opening and above contact, and the eutectic material incoming call test integrated circuit lead above contact is arranged on by contact.Remove eutectic material. |