| abstract |
A method of electrically connecting a first contact on a first wafer to a second contact of a second wafer, the first contact including a rigid material and the second contact including a flexible material relative to the rigid material, Wherein the rigid and flexible material is electrically conductive, the method comprising: contacting a rigid material with a soft material; Applying force to one of the first and second contacts to cause the rigid material to penetrate the malleable material; Heating the rigid and malleable material to soften the malleable material; And confining the malleable material into a predefined area. |