Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c45760c5dcc1ef2b8807a4c04b3a7eff http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ee7972382358ddfa766f8cd0b396645 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af687fe044ae3a57bd114c92fc1ec3b |
classificationCPCAdditional |
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classificationCPCInventive |
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classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
classificationIPCInventive |
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filingDate |
2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_974611d69204890f1024e8e35f9b6a08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c4c25b0751296e89e6fe9553749799f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e82bc3a9ce01449ec61b415826a66bb |
publicationDate |
2015-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9006888-B2 |
titleOfInvention |
Semiconductor device and method of forming stress relief layer between die and interconnect structure |
abstract |
A semiconductor device is made by forming a first conductive layer over a sacrificial carrier. A conductive pillar is formed over the first conductive layer. An active surface of a semiconductor die is mounted to the carrier. An encapsulant is deposited over the semiconductor die and around the conductive pillar. The carrier and adhesive layer are removed. A stress relief insulating layer is formed over the active surface of the semiconductor die and a first surface of the encapsulant. The stress relief insulating layer has a first thickness over the semiconductor die and a second thickness less than the first thickness over the encapsulant. A first interconnect structure is formed over the stress relief insulating layer. A second interconnect structure is formed over a second surface of encapsulant opposite the first interconnect structure. The first and second interconnect structures are electrically connected through the conductive pillar. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10283443-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9941195-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10468345-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10777515-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019333880-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020185341-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11088095-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10269691-B2 |
priorityDate |
2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |