patent/US-2011254157-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011254157-A1

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filingDate	2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8b6e7b5b222e3cabfd331a298a6285e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c60c24d9c8ec32edd03795f5dab0d08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fde3e3cda4edb17efaff744ed2a02c00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_878a3cf99fb193145733c3187553c9ec
publicationDate	2011-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2011254157-A1
titleOfInvention	Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
abstract	A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11257778-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013062760-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8759150-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10409006-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9705302-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022173065-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8936966-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11710713-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9064879-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9437552-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9933577-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9299682-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10720400-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8669655-B2
priorityDate	2008-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 90.