| abstract |
The techniques for providing an IC ship with a plurality of second bonding pads electrically connected to a plurality of first bonding pads having a predetermined small pitch and provided on the IC chip. Owing to the techniques, the second pads can be provided in desired positions, so that the wires for connecting the second pads and a plurality of electrodes, which are provided on a substrate, together can be formed by low-precision printing. When the second pads and the electrodes formed on the substrate by printing are aligned with each other, the second pads and the electrodes on the substrate can be connected together electrically in an opposed state. |