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Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171 |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24246
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-10 |
| filingDate |
2009-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6df7b7e3d228a5d965701a56120a76b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e56912f3251a825b46c93ed7e1141e5c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_362ddccbb99c70198af961b56f50ba60 |
| publicationDate |
2011-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8003496-B2 |
| titleOfInvention |
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die |
| abstract |
A semiconductor device is made by forming a heat spreader over a temporary carrier. A semiconductor die is mounted to the heat spreader. A first polymer layer is formed over the semiconductor die and heat spreader. A first conductive layer is formed over the first polymer layer. The first conductive layer is connected to the heat spreader and contact pads on the semiconductor die. A second polymer layer is formed over the first conductive layer. A second conductive layer is formed over the second polymer layer. The second conductive layer is electrically connected to the first conductive layer. Bumps are formed through a solder masking layer on the second conductive layer. The temporary carrier is removed. The heat spreader dissipates heat from the semiconductor die and provides shielding from inter-device interference. The heat spreader is grounded through the first and second conductive layers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8884422-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011278705-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8916481-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010270644-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8436255-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8409963-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8466997-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9379064-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011156240-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8796840-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011156230-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9048209-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011157452-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8502394-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011157853-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8779601-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9013037-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11721657-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012168932-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012168929-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8410598-B2 |
| priorityDate |
2009-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |