| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_786a55964f0623938e701b4510cacfff |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06551
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2017-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fe1c5c1c3542990c29a9dac4d45b0f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca6d76aede97e29cab2b9388bb14931e |
| publicationDate |
2017-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9761565-B2 |
| titleOfInvention |
Microelectronic packages having embedded sidewall substrates and methods for the producing thereof |
| abstract |
Methods for fabricating microelectronic packages and microelectronic packages are provided. In one embodiment, the microelectronic package fabrication method includes producing a molded panel containing a sidewall substrate. The molded panel is singulated to produce a Fan-Out Wafer Level Package core including a molded body having a fan-out region in which the sidewall substrate is embedded. A side connect trace is printed or otherwise formed on a sidewall of the Fan-Out Wafer Level Package core and extends at least partially across the embedded sidewall substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11329032-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10276523-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11784171-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10319684-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018294233-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10566301-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10396053-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10211141-B1 |
| priorityDate |
2014-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |