| abstract |
In a wiring board structure in which a functional element can be embedded, a wiring board that is resistant to stress is provided, and a method for processing the formation of the wiring board and the connection of the functional element to the wiring board is provided. One or more conductor wiring layers (3, 4) and one or more insulating resin layers (8) are stacked and include one or more metal vias (7) configured to penetrate the insulating resin layers. The wiring board is characterized in that the boundary surface between the metal via and the insulating resin layer has an uneven boundary sectional structure in which the metal via and the insulating resin mesh with each other (FIG. 1). |