| abstract |
An interconnecting structure for a semiconductor die assembly according to the present invention comprises: a substrate on which a wiring circuit is previously formed; A die having a contact pad on the active surface; An adhesive formed on top of the substrate to adhere the die to the substrate, the substrate being formed with vias through the substrate and the adhesive; And a conductive material charged into the via to couple the contact pad of the die to the wiring circuit of the substrate. |