| abstract |
Various semiconductor chip devices and methods for manufacturing the same are disclosed. In one aspect, an interposer (125) having a metallization stack (145) on a first side, a second opposite side, and a first side, and a first semiconductor chip on the metallization stack. (25), the first semiconductor chip (25) at least partially covered by the dielectric layer (165) on the metallization stack, and the first semiconductor chip arranged on the first semiconductor chip. Provided is a semiconductor chip device comprising a reconstructed semiconductor chip package (115), comprising a plurality of semiconductor chips (40, 45) that at least partially overlap laterally. [Selection diagram] Fig. 3 |