| abstract |
The present invention relates to an electronic component package and a method for manufacturing the same. An electronic component package according to an embodiment of the present invention includes an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via penetrating the insulating layer and connected to the conductive pattern. The first and second wiring parts including the conductive connection part disposed between the first and second wiring parts and electrically connecting the one or more through holes and the first and second wiring parts, respectively. And an electronic component that is disposed so as to be surrounded by the through hole and connected to the first wiring portion, and is formed on the electronic component side of the conductive pattern of the first wiring portion. This is a form embedded in the insulating layer of the first wiring part. [Selection] Figure 3 |