| abstract |
It is an object of the present invention to provide an electronic component mounting structure in which an electronic component mounting structure having a structure in which an electronic component is embedded in an insulating film on a wiring board is easily eliminated and flattened due to the step caused by the thickness of the electronic component. .n n n A first insulating film 36a formed on the wiring board 2 with the wiring pattern 32a, the first insulating film 36a formed on the wiring board 2 and provided with an opening 39 in a mounting region in which the electronic component 20 is mounted; The electronic component 20 in which the connection terminal 21 is flip-chip mounted in the wiring pattern 32a exposed by the opening 39 of the first insulating film 36a, and the second insulating film 36b covering the electronic component 20. ), Via holes 36x formed in predetermined portions of the first and second insulating films 36a and 36b on the wiring patterns 32a, and formed on the second insulating films 36b, and via the via holes 36x. The upper wiring pattern 32b connected to the wiring pattern 32a is included. |