| abstract |
There is presented a high frequency module, in which a recess 2 a for mounting power amplifier device is formed on a lower surface of a dielectric substrate 2 , and a recess 2 b for mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate 2 , and a power amplifier device 4 and a surface acoustic wave filter 8 are mounted through conductive bumps 3 a and 3 b on the recesses 2 a and 2 b , respectively. In addition, a through-hole conductor 11 whose one end is exposed at the lower surface of the dielectric substrate 2 is provided between the recesses 2 a and 2 b . The exposed end of the through-hole conductor 11 is attached to a thermal dissipation conductor 15 on an upper surface of an external electric circuit board 7 through a brazing material 13. |