| abstract |
The electronic package includes a semiconductor die 60, conductive pillars 62 extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) having apertures 77 therein to enclose the semiconductor die and to receive individual ones of the conductive pillars. And a body 74. A first interconnect layer 80 is over the LCP body and contacts the holes. There are conductive bodies 82 in the holes to connect the conductive pillars to the first interconnect layer. |