| abstract |
A semiconductor package structure includes a conductive structure, a first semiconductor chip, a second semiconductor chip, a first package body, and an upper semiconductor chip, and a manufacturing method thereof. The first semiconductor chip is electrically connected to the conductive structure. The first semiconductor chip includes at least one first conductive element adjacent to its second surface. The second semiconductor chip is electrically connected to the conductive structure and abuts the first semiconductor chip. The second semiconductor chip includes at least one second conductive element adjacent to its second surface. The first package body is located on the conductive structure to cover the first semiconductor chip and the second semiconductor chip. The first conductive element and the second conductive element are exposed from the first package. The upper semiconductor chip is on the first package and is electrically connected to the first conductive element and the second conductive element. |