| abstract |
An integrated fan-out package having a top-side redistribution wiring structure, a back-side redistribution wiring layer, a ground plane provided in the back-side redistribution wiring layer, and a molding compound layer having a thickness and provided between the back-side redistribution wiring layer and the top-side redistribution wiring structure is disclosed. The package has an RF IC die embedded within the molding compound layer and one or more integrated patch antenna structure provided in the top-side redistribution wiring structure. The one or more integrated patch antenna structure is coupled to the RF IC die and an antenna cavity is provided within the molding compound layer under each of the one or more integrated patch antenna. |