| abstract |
The package includes a redistribution structure; A die package on the first side of the redistribution structure, wherein the die package is above and above the first die, the first die and the second die connected to a second die by metal to metal bonding and dielectric to dielectric bonding. A dielectric material surrounding a and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure; A semiconductor device on the first side of the redistribution structure, the semiconductor device comprising a conductive connector, the second via of the redistribution structure contacting the conductive connector of the semiconductor device; A first molding material on the redistribution structure and surrounding the die package and the semiconductor device; And a package through via extending through the first molding material and contacting the third via of the redistribution structure. |