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Object |
| assignee |
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| filingDate |
2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ce266f12e72962ac7c810339170f3e3
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| publicationDate |
2016-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9397050-B2 |
| titleOfInvention |
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant |
| abstract |
A semiconductor wafer contains a plurality of semiconductor die. A plurality of bumps is formed on the semiconductor wafer. The bumps are electrically connected to contact pads on an active surface of the die. The bumps can also be pillars or stud bumps. A first encapsulant is deposited over the bumps. The semiconductor wafer is singulated to separate the die by cutting channels partially through the wafer and back grinding the wafer down to the channels. A second encapsulant is deposited over the die. A first interconnect structure is formed over a first surface of the second encapsulant. The first interconnect structure is electrically connected to the bumps. A second interconnect structure is formed over a second surface of the second encapsulant. Secondary semiconductor components can be stacked over the second interconnect structure. A third encapsulant is deposited over the stacked secondary components and second interconnect structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11683037-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11227838-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749610-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11093677-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11625523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11394386-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10957679-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101801-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11538763-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11637056-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11264992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985154-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10985760-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11711082-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11545477-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11651132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11159166-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11159165-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11309334-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109148386-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886924-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600526-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11430724-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11368157-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11107768-B2 |
| priorityDate |
2009-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |