| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5587c5d2aaf0f16e87370aa4a5a1e223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f09738b911485189f926cfcc5050758f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a193bbf98a93a588ed793bc48b9a7d3f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36b16e6ba962a07472356673d0ed558b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2010-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_457f70924a7c0da80c4920a101621dc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44dcd6f2669fe2f92531a846c7eb2130
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b411f104174d510cb1443622a69dd1d |
| publicationDate |
2010-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2010106473-A1 |
| titleOfInvention |
Packaged semiconductor product and method for manufacture thereof |
| abstract |
Packaged semiconductor product (2) including a semiconductor device (4) having a substrate (5) comprising a first material, and a packaging structure (6) comprising a second material and having an inner surface. The semiconductor device has a first main surface (8) that comprises contact pads (16) of the semiconductor device (4). The packaged semiconductor product (2) includes a thermo -mechanical- stress distribution layer (34) that comprises a third material. The thermo -mechanical- stress distribution layer (34) enables the inner surface of the packaging structure (6) to substantially displace relative to the semiconductor device (4). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3382362-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3118599-A1 |
| priorityDate |
2009-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |