| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc023c4f8e5024d2b0873152f8aebd0a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1241
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49872
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4871
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2019-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2676b4d1d7ae3423dc82a7d36f1d2a6 |
| publicationDate |
2020-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3589087-A1 |
| titleOfInvention |
Component carrier with integrated thermally conductive cooling structures |
| abstract |
The present invention relates to a component carrier (100) having a stack (101) comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array (110) of exposed highly thermally conductive cooling structures (111) integrally formed with the stack and defining cooling channels (112) in between. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023030789-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11688713-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3852132-A1 |
| priorityDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |