| abstract |
One aspect of the present invention provides a repositioning type process of manufacturing an electronic device. This manufacturing method of the electronic device does not cause electronic components to shift positions in the electronic device, suppress damage to sealants and electronic components, and can easily remove residues generated by said manufacturing process, so as to enhance the reliability of the electronic device, a method for manufacturing an electronic device package and the electronic device package. Said manufacturing method of the electronic device forms a hold resin layer, holds electronic components, forms a sealant layer, obtains a sealant hardener on which the electronic components are arranged, and removes said sealant hardener from the support base. Said removing process of the sealant hardener exposes an active energy ray toward said hold resin layer so as to heat and melt the hold resin layer. |