| abstract |
Multilayer chips in a multilayer polymer structure, on-chip metal bumps on such multilayer chips, intra-chip metal bumps in a multilayer polymer structure, And system-in packages or multichip modules (MCMs), which may include patterned metal layers in a multilayer polymer structure. Multilayer chips in a multilayer polymer structure may be connected to each other or to external circuitry through on-chip metal bumps, intrachip metal bumps, and patterned metal layers. Such system-in packages may be connected to external circuits via solder bumps, metal bumps or wirebonded wires. |