patent/EP-2184776-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2184776-A1

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
filingDate	2008-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deeb21ac15a49fcde608820965985d38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a82f835c7538ec7b8105503acb8f4216
publicationDate	2010-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	EP-2184776-A1
titleOfInvention	Method for making an interconnect structure and low-temperature interconnect component recovery process
abstract	A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer 26 and adhesive layer 16 to an electronic device 18 or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016004238-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102011083627-A1
priorityDate	2008-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5745984-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6657031-B1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129120752 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128467791 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7239 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID991 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129389030

Total number of triples: 55.