http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2009028596-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2009028596-A1 |
| titleOfInvention | Passive element embedded substrate, manufacturing method, and semiconductor device |
| abstract | Provided are a passive element-embedded substrate that is unlikely to break down and can be easily manufactured at low cost, and a method for manufacturing the same. The thin film passive element 4 is formed on the mounting substrate 1 on which the connection pad 2 is formed, and the substrate 7, and the terminal electrode 3 corresponding to the connection pad 2 is formed on the surface on the thin film passive element 4 side facing the connection pad 2. In addition, the terminal electrode 3 is bonded to the connection pad 2 and the substrate 7 is filled between the passive element chip having a thickness of 15 μm or less and the passive element chip and the mounting substrate 1, and the outer periphery of the passive element chip A resin 6 formed so that the upper surface of the portion arranged in the portion coincides with the upper surface of the substrate 7, an LSI connection pad 9 formed on the upper surface of the substrate 7 corresponding to the terminals of the semiconductor element or the semiconductor package, A through via 8 formed so as to electrically connect the corresponding LSI connection pad 9 and the terminal electrode 3 in the passive element chip is provided. |
| priorityDate | 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.