| abstract |
A semiconductor package and a method of forming the same, wherein the semiconductor package is fabricated by attaching a first element to a second element. The first component is assembled by forming a first redistribution structure on a substrate. Vias are then formed over the first redistribution structure, and a chip is attached to the first redistribution structure with the active side facing down. The second element includes a second redistribution structure, which is then attached to the through hole. A molding compound is deposited between the first redistribution structure and the second redistribution structure, and also surrounds the sides of the second element. |