| abstract |
The method includes bonding a first device die to a second device die, encapsulating the first device die to a first encapsulant, and to the second device die to expose a through via in the second device die. performing a back grinding process; forming a first electrical connector on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant and forming an interconnection structure overlapping the first package and the second encapsulant. The interconnect structure includes a second electrical connector. |