patent/CN-103000593-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103000593-B

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filingDate	2012-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2016-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2016-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	CN-103000593-B
titleOfInvention	For method for packing and the structure of semiconductor device
abstract	Disclose the method for packing for semiconductor device and structure.In one embodiment, the semiconductor device of encapsulation comprises redistributing layer (RDL), and it has first surface and the second surface relative with first surface.At least one integrated circuit is connected to the first surface of RDL, and multiple metal coupling is connected to the second surface of RDL.Moulding compound is arranged on the top of the first surface of at least one integrated circuit and RDL.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020024829-A1
priorityDate	2011-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609

Total number of triples: 84.