| abstract |
A component package has a first die that is bonded directly to a second die at an interface, the interface having a conductor-conductor bond. The component package further includes an encapsulation material that encloses the first die and the second die; and a plurality of vias that pass through the encapsulation material. The plurality of vias are disposed adjacent to the first die and the second die. The component package also has a plurality of thermal vias that run through the encapsulation material; and a redistribution structure electrically connected to the first die, the second die, and the plurality of vias. The plurality of thermal vias are disposed on a surface of the second die and adjacent to the first die. |