patent/US-9633939-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9633939-B2

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filingDate	2016-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46798a54adb21a6574d23a15b2854cd1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_798f83a9f48f92d8b76a9cc7eda2bf00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a5b8502393e7345eeac5a181614bdd3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c4eb0e3a0fed64744cf07e80c5b39bf
publicationDate	2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9633939-B2
titleOfInvention	Semiconductor package and manufacturing method thereof
abstract	A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11430772-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021035878-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11682648-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109494182-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020108097-A1
priorityDate	2015-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 97.