| abstract |
Packaging part includes component pipe core, and component pipe core includes the metal column at the top surface of component pipe core and the solder areas on the side wall of metal column.Molding material is around component pipe core, wherein the top surface of molding material and the top surface of component pipe core are substantially flush.Dielectric layer is Chong Die with molding material and component pipe core, and the bottom surface of dielectric layer is contacted with the top surface of the top surface of component pipe core and molding material.Redistribution lines (RDL) extend in dielectric layer to be electrically connected to metal column.The embodiment of the present invention further relates to the structure detected for tube core. |