| abstract |
A method includes placing a plurality of first device dies over a first carrier, wherein the plurality of first device dies and the first carrier combine to form a first composite wafer. The first composite wafer is bonded to the second wafer, and by hybrid bonding, the plurality of first device dies are bonded to the plurality of second device dies in the second wafer. The method also includes separating the first carrier from the plurality of first device dies, encapsulating the plurality of first device dies in an encapsulant, and forming an interconnect structure over the plurality of first device dies and the encapsulant. Embodiments of the present invention relate to a package and a method for manufacturing the same. |