| abstract |
Even when an insulating film is formed around an electronic component by using a droplet discharge method, good conduction is obtained between a wiring and the electronic component. An electronic component having a conductive portion is disposed on a first insulating layer with the conductive portion being directed upward, and a conductive protrusion is provided on the conductive portion. An insulating material is applied by removing the protrusion 72 using a droplet discharge method, and the second insulating layer 60B is provided at a height at which the protrusion 72 protrudes from the upper surface 70a of the electronic component 70; The step of providing the conductive wiring 15 to be connected to the protrusions 72, the insulating material is applied around the electronic component 70 by using a droplet discharge method, and the third insulating layer 60A has a height substantially equal to that of the second insulating layer 60B. Providing a step. [Selection] Figure 4 |