| abstract |
Each embodiment of the present invention is related to semiconductor bare chip being electrically coupled to the electronic unit and method of contact pad.In one embodiment, electronic unit includes：Dielectric sandwich layer；And one or semiconductor bare chip, including the first main surface, arrangement first electrode on the first major surface and second main surface opposite with the first main surface；One or more slot is arranged in dielectric sandwich layer and neighbouring with semiconductor bare chip；And redistribution structure, first electrode is electrically coupled to and is arranged as the component contact pad neighbouring with the second main surface of semiconductor bare chip.Semiconductor bare chip is embedded in dielectric sandwich layer, and redistribution structure is partially disposed on the side wall of slot. |