| abstract |
An IC chip (20) is built in a core sheet (30) of a multilayer printed wiring board. A transition layer (38) is provided on a pad (24) of the IC chip (20). The IC chip can thereby be connected electrically with the multilayer printed wiring board without requiring any lead part or sealing resin. Since a copper transition layer (38) is provided on the pad (24), resin can be prevented from being left on the pad (24) and the connection between the pad (24) and a via hole (60) and their reliability are improved. |