| abstract |
A semiconductor device includes an electronic component having a pad surface on which an electrode pad is formed, and having a back surface opposite the pad surface, a sealing resin disposed to cover side faces of the electronic component while exposing the pad surface at a first surface thereof and the back surface at a second surface thereof, a multilayer interconnection structure including insulating layers stacked one over another and interconnection patterns, having an upper surface thereof being in contact with the first surface, the electrode pad, and the pad surface, and having a periphery thereof situated outside a periphery of the sealing resin, and another pad disposed on the upper surface of the multilayer interconnection structure outside the periphery of the sealing resin, wherein the interconnection patterns include a first interconnection pattern directly connected to the electrode pad and a second interconnection pattern directly connected to said another pad. |