| abstract |
Process for the preparation of an organic substrate with embedded active chips, comprising the steps: (a) stacking a second copper-clad laminate formed with copper wirings, through-holes and recesses on an upper surface of a first copper-clad laminate formed with the copper wirings or the copper wirings and the through-holes; (b) applying anisotropically conductive adhesives or non-conductive adhesives to an upper surface of a semiconductor wafer, and then disposing semiconductor chips (active chips) partitioned within recesses in the second copper-clad laminate and bonding the copper wirings on the first copper-clad laminate to a flip-chip Applying heat and pressure; and (c) stacking a third copper-clad laminate formed with the copper wirings or the copper wirings and the through-holes on the upper surface of the second copper-clad laminate to which the active dies are connected. |