| abstract |
One embodiment is a package having a first package structure. The first package structure includes: a first integrated circuit die having an active side and a back side, the active side having die terminals; a first electrical connector adjacent to the first integrated circuit die; an encapsulant material laterally encapsulating the first integrated circuit die and the first electrical connector; a first redistribution structure disposed on and electrically connected to the die terminals of the first integrated circuit die and the first electrical connector; and thermal elements on the back of the first integrated circuit dies. The package further includes a second package structure bonded to the first electrical connector and the thermal elements with a first group of conductive connectors. |