Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc023c4f8e5024d2b0873152f8aebd0a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2518 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4871 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49872 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2676b4d1d7ae3423dc82a7d36f1d2a6 |
publicationDate |
2019-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2019393117-A1 |
titleOfInvention |
Component Carrier With Integrated Thermally Conductive Cooling Structures |
abstract |
A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11688713-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113038697-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021225798-A1 |
priorityDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |