| abstract |
【wrap up】 A semiconductor device-embedded substrate suitable for miniaturization is provided. In a semiconductor element built-in substrate of the present invention, a semiconductor element is disposed in a recess disposed in an inorganic material substrate, and a through hole disposed in the periphery of the recess of the inorganic material substrate is penetrated. The through hole 20 filled with the hole filling resin 17 and penetrating through the through hole filling resin 17 in the thickness direction is connected to the electrode pad 27 of the semiconductor element 26 by the connection wiring pattern 42. Compared to the case where through holes are formed by drilling through holes in the inorganic material base material 11, the through holes 20 can be made smaller in diameter, and as a result, the semiconductor element built-in substrate 12 can be downsized. [Selection] Figure 4 |