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filingDate 2015-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10015877-B2
titleOfInvention Circuit board comprising heat transfer structure
abstract A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.
priorityDate 2014-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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