| abstract |
Embodiments of the present invention provide an integrated fan-out package with multi-band antennas. The integrated fan-out package includes semiconductor die, molding layer, and multiple integrated fan-out vias. The molding layer is located beside the semiconductor die. The integrated fan-out perforations pass through the molding layer and are arranged to form a plurality of dipole antennas. At least one of the plurality of dipole antennas includes two dipole arms, each of which has an emission band and a radiation band connected to the emission band, and the radiation band has a first part, a first Two parts and a filter part located between the first part and the second part and in contact with the first part and the second part. The cross-sectional area of the filter portion is smaller than the cross-sectional area of the first portion or the second portion of the radiation band. |