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filingDate 2015-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9548277-B2
titleOfInvention Integrated circuit stack including a patterned array of electrically conductive pillars
abstract The present disclosure describes a stacked integrated circuit system that includes two integrated circuit layers stacked on opposite sides of an interposer layer. The interposer layer may include at least one integrated circuit die and an interposer portion that includes a plurality of electrically conductive pillars arranged in a laterally patterned array within the interposer layer.
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